Intel, according to rumors, is to release three generations of processors that will be fabbed on 5nm after Cannonlake and Icelake. Yesterday we already talked a bit about 5nm at TSMC. This new rumor pops up exactly at the same moment.
The third generation would be called Tigerlake and thus is indicative of a second tock in the tick-tick model. This year we will see Kaby lake based on 14nm, this is also an extra tock in the sequence. The tock basically means that Intel is not using a new production node with a smaller fabbed architecture yet sticks to the fabrication process. Last week during the quarterly results announcements the company strangle enough stated that it strives to get back to that tick-tock model. If Cannonlake appears in the 2nd half of 2017 and Icecake would surface a year later then Tigerlake should surface in the 2nd half of 2019 with the first 7nm chips in 2020.
For 5nm we'll probably see a new technology used, EUV-technology. EUV is Extreme ultraviolet lithography (EUVL) and is a next-generation lithography technology using an extreme ultraviolet (EUV) wavelength, currently expected to be 13.5 nm. EUV is currently targeted for possible future use below 15 nm resolution after the 7 nm node, in 2018–19. The primary EUV tool maker, ASML, projects EUV at 5 nm node to require a higher numerical aperture than currently available and multiple patterning to a greater degree than immersion lithography at 20 nm node. It was first targeted for 100 nm conventional patterning.